Publish Time: 2026-06-16 Origin: Site
Industry Background
Electronic components including plated terminals, PCB boards, precision mold assemblies and connectors are highly sensitive to corrosion. Even nano-scale surface oxidation or micro-corrosion may lead to increased contact resistance, poor solderability and insulation failure.
Industry Challenges
1.Micro-corrosion on terminals and connectors
Tin-plated and silver-plated terminals form micro corrosion films under the effect of sulfides, chloride ions and moisture during storage and transportation, resulting in unstable contact resistance and signal interruption.
2.Deteriorated solderability caused by oil mist and dust
Oil mist and dust in workshops settle on PCB pads and component pins, causing cold solder joints, tombstoning and poor wettability during reflow soldering, and lowering production yield.
3.Insulation degradation and short circuits in high-humidity environments
Water films attached to circuit boards under high humidity and condensation reduce insulation resistance, increase leakage current, and even cause dendritic short circuits via electrochemical migration.
4.Micro-corrosion damage to precision molds and toolings
Pitting and rust on cavities of injection molds and stamping molds during long-term storage will be transferred to finished products, leading to mass defective goods.
VCI Solution Value Proposition
We create a dust-free, oil-mist-free and corrosion-free micro environment inside packages to fully protect electrical performance and solderability.
Recommended Solutions & Product Features
VCI Anti-Rust Film / Bag: Built-in anti-static function, suitable for PCB boards and semiconductor packaging to achieve anti-static and anti-rust effects simultaneously.
VCI Anti-Rust Paper: Cut into sheets and placed between pallet and reel layers; its volatile substances will not affect the performance of electronic components.
VCI Emitter: Small slow-release units placed in sealed bags and product boxes to continuously release trace VCI vapor, ideal for compact electronic assemblies.
Expected Benefits
Terminal connection failure rate reduced by over 95%
Reflow soldering yield raised to over 99.5%
Regular oil maintenance for precision molds eliminated, saving labor costs